EURASIP JASP - Special issue on Signal Processing in Advanced Nondestructive Materials Inspection - Announce & Call for papers

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(Apologies for cross-posting.)

 

EURASIP Journal on Advances in Signal Processing

Special issue on Signal Processing in Advanced Nondestructive Materials
Inspection

http://www.hindawi.com/journals/asp/si/ndt.html

Announce and Call for papers

 

We would appreciate if you could distribute this information by your
colleagues and co-workers.

 

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Dear Colleague,

 

Nowadays, techniques of nondestructive testing (NDT) have evolved greatly
due to recent advances in microelectronics and signal processing and
analysis. For example, many image processing and analysis techniques can now
be readily applied at standard video rates using commercially available
hardware, in particular, to methods that generate TV-type image sequences,
such as real-time radiography, pulse-video thermography, ultrasonic-phased
array, laser ultrasonics, and shearography.

 

The main objective of this special issue on “Signal processing in
nondestructive materials inspection”
(http://www.hindawi.com/journals/asp/si/ndt.html) of the EURASIP Journal on
Advances in Signal Processing (http://www.hindawi.com/journals/asp/) is to
promote a comprehensive forum for discussion on the recent advances in
signal processing techniques applied to nondestructive material inspection.

 

Topics of interest include (not limited to):

 

- Signal processing and analysis in advanced NDT;

- Image processing and analysis in advanced NDT;

- Materials characterization using advanced NDT;

- Defect detection and characterization using advanced NDT;

- Pattern recognition and classification for advanced NDT;

- 3D image reconstruction from advanced NDT data;

- Applications of advanced NDT;

- Algorithms development for signal processing and analysis in advanced NDT;

- Software development for defect detection and characterization in NDT
images.

 

 

Submission Instructions:

 

Before submission authors should carefully read over the journal's Author
Guidelines, which are located at
http://www.hindawi.com/journals/asp/guidelines.html.

Prospective authors should submit an electronic copy of their complete
manuscript through the journal Manuscript Tracking System at
http://mts.hindawi.com/ according to the following timetable:

 

Manuscript Due: January 1, 2010;

First Round of Reviews: April 1, 2010;

Publication Date: July 1, 2010.

 

Best regards, 

 

João Manuel R. S. Tavares, Department of Mechanical Engineering, Faculty of
Engineering, University of Porto, Portugal (tavares@fe.up.pt)

(Lead Guest Editor)

 

João Marcos A. Rebello, Department of Metallurgy and Materials,
Technological Center, Faculty of Engineering, Federal University of Rio de
Janeiro, Brazil (jmarcos@metalmat.ufrj.br)

(Guest Editor)