Re: DAS WG F2F meeting at TPAC 2018? from Kostiainen, Anssi on 2018-04-23 (public-device-apis@w3.org from April 2018)

From: Kostiainen, Anssi <anssi.kostiainen@intel.com>
Date: Mon, 23 Apr 2018 10:30:39 +0000
To: W3C Devices and Sensors WG <public-device-apis@w3.org>
Message-ID: <130DB52A-ECAD-4CED-AD4D-56A3E61B4596@intel.com>

Hi,

> On 11 Apr 2018, at 16.23, Kostiainen, Anssi <anssi.kostiainen@intel.com> wrote:
> 
> Hi Device and Sensors WG participants,
> 
> TPAC 2018 [1] takes place 22-26 October 2018 in Lyon, France.
> 
> Device and Sensors WG has an opportunity meet during the TPAC week on either of the following dates:
> 
> Mon-Tue 22-23 October 2018
> Thu-Fri 25-26 October 2018
> 
> Please let me know by 18 April if you are aware of blackout dates around TPAC dates that should be considered.

Based on feedback received, I've requested Mon-Tue 22-23 October 2018 as the meeting days for the DAS WG F2F meeting at TPAC 2018.

Thanks,

-Anssi (Device and Sensors WG Chair)

> [1] https://www.w3.org/2018/10/TPAC/Overview.html

Received on Monday, 23 April 2018 10:31:06 UTC